High-Power Packaging
Background
In a temperature-critical application, optimal heat dissipation with minimal Rth is necessary to ensure stable operating conditions for all components.
Initial situation
In a temperature critical application optimal heat dissipation is necessary to ensure stable operating conditions for all components.
Task
The previous normal ambient temperature circuit is to be
transferred to a board with heat-sink technology, so several components
are to be replaced.
Procedure
- Determination of the critical components
- Definition of heat dissipation requirements
- Preparation of the implementation concept with the new electronics manufacturer
- Circuit porting onto the new carrier
- New dimensioning of critical components and coordination with the manufacturers
Processing time
About 6 months
Result
Successful component group tests at high ambient temperatures
Customer: automotive OEM supplier
